Mechanical Engineering
Hill Country Engineering is ready to take on your toughest engineering challenges, from conceptual design to multiphysics simulation and analysis.
Thermal management design and analysis
- Design and optimization of electronic cooling systems
- 3D steady state or transient thermal/CFD simulation of any combination of heat transfer mechanisms including: conduction, natural convection, forced convection, liquid cooling, radiation, and solar loading
- Thermal analysis with moving boundaries such as with ice formation
Electronics reliability design and analysis
- Solder joint fatigue analysis associated with thermal cycling and/or vibration
- MTBF reliability prediction/analysis, including de-rating from thermal analysis
Mechanical system design and analysis
- Electronics packaging
- Static structural design and FEA analysis
- Design and dynamic analysis of complex mechanisms
- 3-dimensional tolerance simulation / Monte Carlo simulation of complex assemblies
- Bolted joint design, analysis/simulation
- Press fit, shrink fit, and slip fit design and analysis
- Environmental and EMI seal design, analysis, and optimization
- Vibration analysis/simulation, including spectral response, stress, and/or fatigue analysis
- Shock response analysis/simulation including: drop test analysis, functional shock, and weapon fire shock
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